JPS6214959B2 - - Google Patents
Info
- Publication number
- JPS6214959B2 JPS6214959B2 JP10919079A JP10919079A JPS6214959B2 JP S6214959 B2 JPS6214959 B2 JP S6214959B2 JP 10919079 A JP10919079 A JP 10919079A JP 10919079 A JP10919079 A JP 10919079A JP S6214959 B2 JPS6214959 B2 JP S6214959B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- holes
- hole
- leg
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 59
- 238000005452 bending Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 21
- 238000005476 soldering Methods 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 238000007747 plating Methods 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004080 punching Methods 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000007872 degassing Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000013022 venting Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10919079A JPS5633895A (en) | 1979-08-29 | 1979-08-29 | Bothhside printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10919079A JPS5633895A (en) | 1979-08-29 | 1979-08-29 | Bothhside printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5633895A JPS5633895A (en) | 1981-04-04 |
| JPS6214959B2 true JPS6214959B2 (en]) | 1987-04-04 |
Family
ID=14503911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10919079A Granted JPS5633895A (en) | 1979-08-29 | 1979-08-29 | Bothhside printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5633895A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998591A (ja) * | 1982-11-27 | 1984-06-06 | 松下電器産業株式会社 | 両面回路接続方法 |
| JPS6052669U (ja) * | 1983-09-19 | 1985-04-13 | 三洋電機株式会社 | 回路基板装置 |
-
1979
- 1979-08-29 JP JP10919079A patent/JPS5633895A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5633895A (en) | 1981-04-04 |
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